產品介紹

NEMST-D2002 系列

垂直式電漿去膠渣機（標準型,15/28 Panels）

垂直式電漿去膠渣機（標準型,15/28 Panels）
垂直式電漿去膠渣機（標準型,15/28 Panels）
  • Unique Plasma Technology integrated with Inductively Coupling Plasma (ICP) and Hollow Cathode Plasma (HCP) design.
  • ICP & HCP are generated at the same time and it can substantially increase the plasma density as well as the process speed.
  • By employing water-cooling electrodes, the resistance of electrode surface can remain the same and thus increases the process stability. Multiple Processing Gas Selectivity. Mutiple Easy-Maintain and Low-Maintenance-Cost Designs.
  • High Automation and Operator Friendly Design.
  • Depending on the customer's requirements, the machine can be produced in some customized designs.
  • Stepwise processing is available.
  • Convenient Cart/Rack Loading/Unloading Designs.
  • High Plasma Desmear Uniformity. Very High Plasma Desmear Efficiency.
  • Multiple Process Gases Selectivity (CF4, O2, N2, Ar, H2 and etc.) to achieve the best surface treatment effects.
  • High Capability (15/28 panels, 510 mm x 610 mm or 60/112 panels, 200 mm x 250 mm / Rigid, Flex, Rigid-Flex Boards).
  • Very High Plasma Desmear Efficiency.
  • Desmear / Descum / Cleaning.
  • Blind Vias and Through Holes Plasma Treatment. Interlayer Adhesion Promotion.
  • Resist / Emulsion Removal.
  • Surface Activation / Surface Roughness Improvement / Surface Modification.